Bump connections and wire bonds of 3D CMOL FPGA can serve as
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Description
Download scientific diagram | Bump connections and wire bonds of 3D CMOL FPGA can serve as programming communication channels and IOs respectively. from publication: 3D integration of CMOL structures for FPGA applications | In this paper, a novel 3D CMOS nanohybrid technology, 3D CMOL, is introduced to establish FPGA chips. By combining two leading technologies, hybrid CMOS/nanoelectronic circuit (CMOL) and 3D integration, 3D CMOL can provide a feasible and more efficient fabrication/assembly | FPGA, CMOS and FPGAs | ResearchGate, the professional network for scientists.
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
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PDF) Nanoelectronics, Nanophotonics, and Nanomagnetics: Report of the National Nanotechnology Initiative Workshop February 11-13, 2004
PDF) 3D integration of CMOL structures for FPGA applications
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